DS90CR483VJD
vs
DS90CR483SLB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
TQFP-100
|
TQCCN, LGA128,20X20,20
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
8
|
8
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-644; TIA-644
|
EIA-644; TIA-644
|
| JESD-30 Code |
S-PQFP-G100
|
R-XQCC-N128
|
| JESD-609 Code |
e0
|
e0
|
| Length |
14 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
8
|
1
|
| Number of Terminals |
100
|
128
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-10 °C
|
-10 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TFQFP
|
TQCCN
|
| Package Equivalence Code |
TQFP100,.63SQ
|
LGA128,20X20,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
97.4 ns
|
|
| Seated Height-Max |
1.2 mm
|
1.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Transmit Delay-Max |
51.69 ns
|
|
| Width |
14 mm
|
10 mm
|
| Base Number Matches |
4
|
1
|
| Supply Current-Max |
|
210 mA
|
|
|
|
Compare DS90CR483VJD with alternatives
Compare DS90CR483SLB with alternatives