DSP56001FC27
vs
DSP56001RC27
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFP
|
|
Package Description |
LFQFP,
|
PGA, PGA88,13X13
|
Pin Count |
132
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
16
|
Barrel Shifter |
NO
|
NO
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
27 MHz
|
27 MHz
|
External Data Bus Width |
24
|
24
|
Format |
FIXED POINT
|
FLOATING POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQFP-G132
|
S-CPGA-P88
|
JESD-609 Code |
e0
|
|
Length |
20 mm
|
34.544 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
132
|
88
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
LFQFP
|
PGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.6 mm
|
3.04 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
HCMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
PIN/PEG
|
Terminal Pitch |
0.5 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
PERPENDICULAR
|
Width |
20 mm
|
34.544 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
Bit Size |
|
24
|
Integrated Cache |
|
NO
|
Number of External Interrupts |
|
2
|
Number of Serial I/Os |
|
1
|
On Chip Data RAM Width |
|
24
|
On Chip Program ROM Width |
|
24
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Equivalence Code |
|
PGA88,13X13
|
RAM (words) |
|
512
|
ROM Programmability |
|
MROM
|
Supply Current-Max |
|
155 mA
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare DSP56001FC27 with alternatives
Compare DSP56001RC27 with alternatives