DSP56001FC27 vs DSP56001RC27 feature comparison

DSP56001FC27 Motorola Mobility LLC

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DSP56001RC27 NXP Semiconductors

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LFQFP, PGA, PGA88,13X13
Pin Count 132
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 16
Barrel Shifter NO NO
Boundary Scan NO NO
Clock Frequency-Max 27 MHz 27 MHz
External Data Bus Width 24 24
Format FIXED POINT FLOATING POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G132 S-CPGA-P88
JESD-609 Code e0
Length 20 mm 34.544 mm
Low Power Mode YES YES
Number of Terminals 132 88
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LFQFP PGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.6 mm 3.04 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology HCMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING PIN/PEG
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 20 mm 34.544 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Bit Size 24
Integrated Cache NO
Number of External Interrupts 2
Number of Serial I/Os 1
On Chip Data RAM Width 24
On Chip Program ROM Width 24
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Equivalence Code PGA88,13X13
RAM (words) 512
ROM Programmability MROM
Supply Current-Max 155 mA
Temperature Grade INDUSTRIAL

Compare DSP56001FC27 with alternatives

Compare DSP56001RC27 with alternatives