DSP56002PV66
vs
DSP56002PV66
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
20 X 20 MM, 1.50 MM HEIGHT, PLASTIC, TQFP-144
|
LFQFP,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
16
|
16
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
24
|
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
66 MHz
|
66 MHz
|
External Data Bus Width |
24
|
24
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e0
|
|
Length |
20 mm
|
20 mm
|
Low Power Mode |
NO
|
YES
|
Number of DMA Channels |
|
|
Number of External Interrupts |
3
|
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
144
|
144
|
Number of Timers |
1
|
|
On Chip Data RAM Width |
24
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP144,.87SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
512
|
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Current-Max |
130 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
20 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
QFP
|
Pin Count |
|
144
|
|
|
|