DSP96002RC60
vs
DSP96002RC60
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
PGA
|
PGA
|
Package Description |
PGA, PGA223,18X18
|
PGA,
|
Pin Count |
223
|
223
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
32
|
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
60 MHz
|
60 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-CPGA-P223
|
S-PPGA-P223
|
JESD-609 Code |
e0
|
|
Length |
47.244 mm
|
47.244 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
2
|
|
Number of External Interrupts |
3
|
|
Number of Serial I/Os |
|
|
Number of Terminals |
223
|
223
|
Number of Timers |
2
|
|
On Chip Data RAM Width |
32
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
PGA
|
PGA
|
Package Equivalence Code |
PGA223,18X18
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
512
|
|
Seated Height-Max |
3.81 mm
|
3.81 mm
|
Supply Current-Max |
500 mA
|
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
Width |
47.244 mm
|
47.244 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
|
|
|