DSPF56362AG120
vs
DSPF56362PV120
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
20 X 20 MM, 0.50 MM PITCH, 1.40 MM HEIGHT, PLASTIC, LQFP-144
|
LFQFP, QFP144,.87SQ,20
|
Pin Count |
144
|
144
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
18
|
18
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
24
|
24
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
120 MHz
|
120 MHz
|
External Data Bus Width |
24
|
24
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
20 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
144
|
144
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP144,.87SQ,20
|
QFP144,.87SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
11264
|
11264
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Current-Max |
181 mA
|
181 mA
|
Supply Voltage-Max |
3.46 V
|
3.46 V
|
Supply Voltage-Min |
3.14 V
|
3.14 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
Width |
20 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
|
|
|