DSPIC30F2011AT-30E/MM
vs
DSPIC30F2011CT-30I/P
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28
|
0.300 INCH, PLASTIC, DIP-18
|
| Pin Count |
28
|
18
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| External Data Bus Width |
|
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQCC-N28
|
R-PDIP-T18
|
| Length |
6 mm
|
22.86 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
28
|
18
|
| On Chip Program ROM Width |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1 mm
|
5.334 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
2.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
6 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC30F2011AT-30E/MM with alternatives
Compare DSPIC30F2011CT-30I/P with alternatives