DSPIC30F2011CT-30I/P vs DSPIC30F2011BT-30IML-ES feature comparison

DSPIC30F2011CT-30I/P Microchip Technology Inc

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DSPIC30F2011BT-30IML-ES Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP QFN
Package Description 0.300 INCH, PLASTIC, DIP-18 8 X 8 MM, PLASTIC, QFN-44
Pin Count 18 44
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 16 16
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width
JESD-30 Code R-PDIP-T18 S-PQCC-N44
Length 22.86 mm 8 mm
Number of Terminals 18 44
On Chip Program ROM Width 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP VQCCN
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER, VERY THIN PROFILE
ROM Programmability FLASH FLASH
Seated Height-Max 5.334 mm 1 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL QUAD
Width 7.62 mm 8 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 1
Qualification Status Not Qualified
Terminal Finish Matte Tin (Sn)

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Compare DSPIC30F2011BT-30IML-ES with alternatives