DSPIC33CK32MP102-H/M6
vs
DSPIC33CK64MP103-H/M5
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
UQFN-28
|
UQFN-36
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
64 MHz
|
64 MHz
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
NO
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQCC-N28
|
S-PQCC-N36
|
| Length |
4 mm
|
5 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
4
|
4
|
| Number of Terminals |
28
|
36
|
| Number of Timers |
6
|
1
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC28,16SQ,16
|
LCC36,.2SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| RAM (words) |
8192
|
4096
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
0.6 mm
|
0.6 mm
|
| Supply Current-Max |
300 mA
|
300 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Number of External Interrupts |
|
4
|
|
|
|
Compare DSPIC33CK32MP102-H/M6 with alternatives
Compare DSPIC33CK64MP103-H/M5 with alternatives