DSPIC33EP512MU810-E/PT
vs
PIC24EP512GP202T-I/MM
feature comparison
| Rohs Code |
|
Yes
|
| Part Life Cycle Code |
|
Active
|
| Ihs Manufacturer |
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
|
6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
Microchip
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
|
16
|
| CPU Family |
|
PIC
|
| Clock Frequency-Max |
|
60 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQCC-N28
|
| JESD-609 Code |
|
e3
|
| Length |
|
6 mm
|
| Number of I/O Lines |
|
21
|
| Number of Terminals |
|
28
|
| On Chip Program ROM Width |
|
24
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC28,.24SQ,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
|
Not Qualified
|
| RAM (bytes) |
|
49152
|
| ROM (words) |
|
174762
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1 mm
|
| Speed |
|
70 MHz
|
| Supply Current-Max |
|
150 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3.3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
|
1
|
|
|
|
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