DSPIC33EP64GP504-I/TL
vs
DSPIC33EP512MU814-I/PH
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
QFP
|
Package Description |
VTLA-44
|
TQFP-144
|
Pin Count |
44
|
144
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Has ADC |
YES
|
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
60 MHz
|
60 MHz
|
DAC Channels |
NO
|
|
DMA Channels |
YES
|
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
FLOATING POINT
|
Integrated Cache |
NO
|
NO
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-XQCC-N44
|
S-PQFP-G144
|
JESD-609 Code |
e4
|
e3
|
Length |
6 mm
|
16 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
4
|
15
|
Number of External Interrupts |
3
|
5
|
Number of I/O Lines |
35
|
|
Number of Terminals |
44
|
144
|
Number of Timers |
5
|
9
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TFQFP
|
Package Equivalence Code |
LCC44,.24SQ,20
|
TQFP144,.7SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
8192
|
|
RAM (words) |
8192
|
53248
|
ROM (words) |
21845
|
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
1.2 mm
|
Speed |
70 MHz
|
|
Supply Current-Max |
60 mA
|
320 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
6 mm
|
16 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
2
|
Factory Lead Time |
|
7 Weeks
|
Moisture Sensitivity Level |
|
3
|
Number of Serial I/Os |
|
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare DSPIC33EP64GP504-I/TL with alternatives
Compare DSPIC33EP512MU814-I/PH with alternatives