DSPIC33EV64GM006T-E/MRVAO
vs
DSPIC33EV128GM004T-H/MR
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-64
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
A/D CONVERTERS IS ALSO AVAILABLE IN 36-CH 10-BIT, OPERATES UPTO 60MIPS
|
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
|
Bit Size |
16
|
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
40 MHz
|
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
Internal Bus Architecture |
MULTIPLE
|
|
JESD-30 Code |
S-PQCC-N64
|
|
JESD-609 Code |
e3
|
|
Length |
9 mm
|
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
4
|
|
Number of External Interrupts |
3
|
|
Number of Terminals |
64
|
|
Number of Timers |
9
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVQCCN
|
QFP
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
RAM (words) |
8192
|
|
ROM Programmability |
FLASH
|
|
Screening Level |
AEC-Q100; TS 16949
|
|
Seated Height-Max |
1 mm
|
|
Supply Current-Max |
55 mA
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Width |
9 mm
|
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC33EV64GM006T-E/MRVAO with alternatives
Compare DSPIC33EV128GM004T-H/MR with alternatives