DSPIC33FJ16GS504-50I/TL
vs
DSPIC33FJ16GS504T-50E/ML
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
VTLA-44
|
QFN-44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
50 MHz
|
40 MHz
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-XBGA-N44
|
S-PQCC-N44
|
| JESD-609 Code |
e4
|
|
| Length |
6 mm
|
8 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of External Interrupts |
3
|
3
|
| Number of I/O Lines |
35
|
|
| Number of Terminals |
44
|
44
|
| Number of Timers |
3
|
3
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HLBGA
|
HVQCCN
|
| Package Equivalence Code |
LGA44,12X12,20
|
LCC44,.32SQ,25
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| RAM (words) |
2048
|
2048
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Speed |
40 MHz
|
|
| Supply Current-Max |
160 mA
|
160 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
BUTT
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
6 mm
|
8 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC33FJ16GS504-50I/TL with alternatives
Compare DSPIC33FJ16GS504T-50E/ML with alternatives