EDI88130LPS35FI vs EDI88130LPS35FB feature comparison

EDI88130LPS35FI Microsemi Corporation

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EDI88130LPS35FB White Microelectronics

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP WHITE MICROELECTRONICS
Part Package Code DFP
Package Description CERAMIC, DFP-32 CERAMIC, FP-32
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature BATTERY BACKUP OPERATION
I/O Type COMMON
JESD-30 Code R-CDFP-F32 R-CDFP-F32
Length 20.828 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP
Package Equivalence Code FL32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.9464 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.414 mm
Base Number Matches 5 5
Screening Level MIL-STD-883

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