EDI8F32256C12MMC
vs
SYS32256ZKI-25
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
APTA GROUP INC
|
Package Description |
SIMM-64
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
Access Time-Max |
12 ns
|
25 ns
|
JESD-30 Code |
R-XSMA-N64
|
R-XZMA-T64
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
256KX32
|
256KX32
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
ZIG-ZAG
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
ZIP
|
Pin Count |
|
64
|
ECCN Code |
|
3A991.B.2.A
|
HTS Code |
|
8542.32.00.41
|
|
|
|
Compare EDI8F32256C12MMC with alternatives
Compare SYS32256ZKI-25 with alternatives