EDI8F32259C20MNC vs AP32M256M7-20 feature comparison

EDI8F32259C20MNC White Electronic Designs Corp

Buy Now Datasheet

AP32M256M7-20 Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP INTEGRATED SILICON SOLUTION INC
Package Description SIMM-72 SIMM-72
Reach Compliance Code unknown compliant
Access Time-Max 20 ns 20 ns
I/O Type COMMON COMMON
JESD-30 Code R-XSMA-N72 R-XSMA-N72
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE STANDARD SRAM
Memory Width 32 32
Number of Functions 1 1
Number of Terminals 72 72
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX32 256KX32
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code SIMM SIMM
Package Equivalence Code SSIM72 SSIM72
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 17.272 mm 15.113 mm
Standby Current-Max 0.04 A 0.04 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 1.44 mA 1.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Additional Feature LG-MAX; WD-MAX
JESD-609 Code e0
Length 108.077 mm
Terminal Finish Tin/Lead (Sn/Pb)
Width 8.89 mm

Compare EDI8F32259C20MNC with alternatives

Compare AP32M256M7-20 with alternatives