EDI8F81027C100B6C vs EDI8F81027LP100B6C feature comparison

EDI8F81027C100B6C White Electronic Designs Corp

Buy Now Datasheet

EDI8F81027LP100B6C White Electronic Designs Corp

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP WHITE ELECTRONIC DESIGNS CORP
Package Description DIP-32 DIP-32
Reach Compliance Code unknown unknown
Access Time-Max 100 ns 100 ns
JESD-30 Code R-XDMA-T32 R-XDMA-T32
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1

Compare EDI8F81027C100B6C with alternatives

Compare EDI8F81027LP100B6C with alternatives