EDI8F8512C35M6C
vs
MT5C2565-35
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
WHITE ELECTRONIC DESIGNS CORP
|
MICRON TECHNOLOGY INC
|
| Package Description |
DIP-32
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Access Time-Max |
35 ns
|
35 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-XDMA-T32
|
R-PDIP-T28
|
| Memory Density |
4194304 bit
|
262144 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
8
|
4
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
28
|
| Number of Words |
524288 words
|
65536 words
|
| Number of Words Code |
512000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
512KX8
|
64KX4
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP32,.6
|
DIP28,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.04 A
|
0.007 A
|
| Standby Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Current-Max |
0.39 mA
|
0.12 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare EDI8F8512C35M6C with alternatives
Compare MT5C2565-35 with alternatives