EFM32GG11B310F2048GL112-AR vs EFM32GG11B310F2048GL112-B feature comparison

EFM32GG11B310F2048GL112-AR Silicon Laboratories Inc

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EFM32GG11B310F2048GL112-B Silicon Laboratories Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SILICON LABORATORIES INC SILICON LABORATORIES INC
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 2
Package Description BGA-112
ECCN Code 3A991.A.2
Date Of Intro 2018-08-21
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan YES
CPU Family CORTEX-M4
Clock Frequency-Max 50 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width
Format FLOATING POINT
Integrated Cache NO
JESD-30 Code S-PBGA-B112
JESD-609 Code e4
Length 10 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of DMA Channels 24
Number of I/O Lines 90
Number of Serial I/Os 12
Number of Terminals 112
Number of Timers 13
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA112,11X11,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
RAM (bytes) 393216
ROM (words) 2097152
ROM Programmability FLASH
Seated Height-Max 1.3 mm
Speed 72 MHz
Supply Current-Max 200 mA
Supply Voltage-Max 3.8 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish NICKEL GOLD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm

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