EFM32GG11B310F2048GL112-B
vs
EFM32GG11B310F2048GL112-AR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Package Description |
BGA-112
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2018-08-21
|
|
Has ADC |
YES
|
|
Address Bus Width |
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
CPU Family |
CORTEX-M4
|
|
Clock Frequency-Max |
50 MHz
|
|
DAC Channels |
YES
|
|
DMA Channels |
YES
|
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PBGA-B112
|
|
JESD-609 Code |
e4
|
|
Length |
10 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of DMA Channels |
24
|
|
Number of I/O Lines |
90
|
|
Number of Serial I/Os |
12
|
|
Number of Terminals |
112
|
|
Number of Timers |
13
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LFBGA
|
|
Package Equivalence Code |
BGA112,11X11,32
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
260
|
|
RAM (bytes) |
393216
|
|
ROM (words) |
2097152
|
|
ROM Programmability |
FLASH
|
|
Seated Height-Max |
1.3 mm
|
|
Speed |
72 MHz
|
|
Supply Current-Max |
200 mA
|
|
Supply Voltage-Max |
3.8 V
|
|
Supply Voltage-Min |
3.3 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Terminal Finish |
NICKEL GOLD
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
10 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
|
|
|