EFM32WG890F128-BGA112R
vs
EFM32WG890F128-B-BGA112
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
End Of Life
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
Package Description |
LFBGA,
|
LFBGA, BGA112,11X11,32
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
48 MHz
|
48 MHz
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
Length |
10 mm
|
10 mm
|
Number of I/O Lines |
90
|
90
|
Number of Terminals |
112
|
112
|
PWM Channels |
YES
|
YES
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Speed |
48 MHz
|
48 MHz
|
Supply Voltage-Max |
3.8 V
|
3.8 V
|
Supply Voltage-Min |
1.98 V
|
3 V
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
10 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
3
|
Date Of Intro |
|
2019-11-15
|
Boundary Scan |
|
NO
|
CPU Family |
|
CORTEX-M4
|
DAC Channels |
|
YES
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
NO
|
JESD-30 Code |
|
S-PBGA-B112
|
JESD-609 Code |
|
e4
|
Low Power Mode |
|
YES
|
Moisture Sensitivity Level |
|
3
|
Number of DMA Channels |
|
12
|
Number of External Interrupts |
|
16
|
Number of Serial I/Os |
|
7
|
Number of Timers |
|
5
|
On Chip Data RAM Width |
|
8
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Equivalence Code |
|
BGA112,11X11,32
|
RAM (bytes) |
|
32768
|
RAM (words) |
|
8192
|
ROM (words) |
|
131072
|
ROM Programmability |
|
FLASH
|
Seated Height-Max |
|
1.3 mm
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NICKEL GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare EFM32WG890F128-BGA112R with alternatives
Compare EFM32WG890F128-B-BGA112 with alternatives