EFM8BB31F64A-C-4QFN24
vs
EFM8BB31F64A-C-4QFN24R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2019-01-22
|
2019-01-22
|
| Samacsys Manufacturer |
Silicon Labs
|
Silicon Labs
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
YES
|
|
| DMA Channels |
NO
|
YES
|
| External Data Bus Width |
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
4 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of I/O Lines |
20
|
21
|
| Number of Terminals |
24
|
24
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
YES
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (bytes) |
4352
|
|
| ROM (words) |
65536
|
|
| ROM Programmability |
FLASH
|
|
| Speed |
50 MHz
|
50 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.2 V
|
2.2 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EFM8BB31F64A-C-4QFN24 with alternatives
Compare EFM8BB31F64A-C-4QFN24R with alternatives