EFM8BB31F64I-C-QFN32
vs
EFM8BB31F64I-C-QFP32R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Package Description |
QFN-32
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2019-01-22
|
2019-01-22
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| DAC Channels |
YES
|
|
| DMA Channels |
NO
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N32
|
|
| Length |
4 mm
|
7 mm
|
| Number of I/O Lines |
29
|
29
|
| Number of Terminals |
32
|
32
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
HVQCCN
|
TQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
0.55 mm
|
|
| Speed |
50 MHz
|
50 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.2 V
|
2.2 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Bit Size |
|
8
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare EFM8BB31F64I-C-QFN32 with alternatives
Compare EFM8BB31F64I-C-QFP32R with alternatives