EFM8LB12F32ES1-B-QFN24R
vs
EFM8LB12F32ES1-B-QFN24
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2018-02-01
|
2018-02-01
|
| JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
| Length |
3 mm
|
3 mm
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC24,.13SQ,16
|
LCC24,.13SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.2 V
|
2.2 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
3 mm
|
3 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EFM8LB12F32ES1-B-QFN24R with alternatives
Compare EFM8LB12F32ES1-B-QFN24 with alternatives