EL7457CLZ
vs
EL7457CLZ-T13
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFN, QSOP, SOIC
|
QFN
|
Package Description |
HVQCCN, LCC16,.16SQ,25
|
QFN-16
|
Pin Count |
16, 16, 16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
78 Weeks
|
26 Weeks, 1 Day
|
Driver Number of Bits |
4
|
|
High Side Driver |
YES
|
YES
|
Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
JESD-30 Code |
S-XQCC-N16
|
S-PQCC-N16
|
JESD-609 Code |
e3
|
e3
|
Length |
4 mm
|
4 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
0.1 A
|
|
Output Peak Current Limit-Nom |
2 A
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HQCCN
|
Package Equivalence Code |
LCC16,.16SQ,25
|
LCC16,.16SQ,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
1.03 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Supply Voltage1-Nom |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
L16.4X4H
|
Date Of Intro |
|
2017-10-16
|
Samacsys Manufacturer |
|
Renesas Electronics
|
|
|
|
Compare EL7457CLZ with alternatives
Compare EL7457CLZ-T13 with alternatives