EL7457CUZ-T7
vs
EL7457CLZ-T7
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QSOP
|
QFN
|
| Package Description |
SSOP,
|
HQCCN,
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
MDP0040
|
L16.4X4H
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks, 1 Day
|
16 Weeks, 3 Days
|
| Date Of Intro |
2017-10-16
|
2017-10-16
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQCC-N16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
4 mm
|
| Moisture Sensitivity Level |
2
|
3
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
HQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.72 mm
|
1.03 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.635 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.91 mm
|
4 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare EL7457CUZ-T7 with alternatives
Compare EL7457CLZ-T7 with alternatives