ELANSC410-66AC
vs
ELANSC410-66AI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-292
|
PLASTIC, BGA-292
|
| Pin Count |
292
|
292
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
0.032 MHz
|
0.032 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B292
|
S-PBGA-B292
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27 mm
|
27 mm
|
| Number of I/O Lines |
32
|
32
|
| Number of Terminals |
292
|
292
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA292,20X20,50
|
BGA292,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.61 mm
|
2.61 mm
|
| Speed |
66 MHz
|
66 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ELANSC410-66AC with alternatives
Compare ELANSC410-66AI with alternatives