EP20K100QC208-2X vs EP20K100FC324-2 feature comparison

EP20K100QC208-2X Intel Corporation

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EP20K100FC324-2 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description , BGA, BGA324(UNSPEC)
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Base Number Matches 3 2
Rohs Code No
ECCN Code 3A991.D
JESD-30 Code S-PBGA-B324
JESD-609 Code e0
Length 19 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 4
Number of I/O Lines 252
Number of Inputs 246
Number of Logic Cells 4160
Number of Outputs 246
Number of Terminals 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 4 DEDICATED INPUTS, 252 I/O
Output Function MACROCELL
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324(UNSPEC)
Package Shape SQUARE
Package Style GRID ARRAY
Programmable Logic Type LOADABLE PLD
Propagation Delay 3 ns
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm

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