EP2AGX45DF25C5
vs
EP2AGX45DF25C6
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B572
|
S-PBGA-B572
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Inputs |
252
|
252
|
| Number of Logic Cells |
42959
|
42959
|
| Number of Outputs |
252
|
252
|
| Number of Terminals |
572
|
572
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA572,24X24,40
|
BGA572,24X24,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
220
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
NOT SPECIFIED
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare EP2AGX45DF25C5 with alternatives
Compare EP2AGX45DF25C6 with alternatives