EP2AGX45DF25C5N
vs
EP2AGX45DF25I3N
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
25 X 25 MM, LEAD FREE, MS-034, FBGA-572
|
HBGA,
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Intel
|
|
| Clock Frequency-Max |
500 MHz
|
500 MHz
|
| JESD-30 Code |
S-PBGA-B572
|
S-PBGA-B572
|
| JESD-609 Code |
e1
|
e1
|
| Length |
25 mm
|
25 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of CLBs |
1805
|
|
| Number of Inputs |
260
|
|
| Number of Logic Cells |
42959
|
|
| Number of Outputs |
260
|
|
| Number of Terminals |
572
|
572
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1805 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HBGA
|
| Package Equivalence Code |
BGA572,24X24,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.2 mm
|
2.2 mm
|
| Supply Voltage-Max |
0.93 V
|
0.93 V
|
| Supply Voltage-Min |
0.87 V
|
0.87 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
25 mm
|
25 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
572
|
|
|
|
Compare EP2AGX45DF25C5N with alternatives
Compare EP2AGX45DF25I3N with alternatives