EP2AGX45DF25C5N vs EP2AGX45DF25I5N feature comparison

EP2AGX45DF25C5N Intel Corporation

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EP2AGX45DF25I5N Altera Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP ALTERA CORP
Package Description 25 X 25 MM, LEAD FREE, MS-034, FBGA-572 25 X 25 MM, LEAD FREE, MS-034, FBGA-572
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Clock Frequency-Max 500 MHz 500 MHz
JESD-30 Code S-PBGA-B572 S-PBGA-B572
JESD-609 Code e1 e1
Length 25 mm 25 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1805
Number of Inputs 260 252
Number of Logic Cells 42959 42959
Number of Outputs 260 252
Number of Terminals 572 572
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1805 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA572,24X24,40 BGA572,24X24,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 25 mm 25 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 572
Technology CMOS

Compare EP2AGX45DF25C5N with alternatives

Compare EP2AGX45DF25I5N with alternatives