EP3C25F256C8
vs
EP3C25F256C8NES
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
17 X 17 MM, 1 MM PITCH, FBGA-256
|
LBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Clock Frequency-Max |
472.5 MHz
|
472.5 MHz
|
JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B256
|
JESD-609 Code |
e0
|
e1
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
24624
|
24624
|
Number of Inputs |
156
|
|
Number of Logic Cells |
24624
|
|
Number of Outputs |
156
|
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
24624 CLBS
|
24624 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.25 V
|
1.25 V
|
Supply Voltage-Min |
1.15 V
|
1.15 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
|
|
|
Compare EP3C25F256C8 with alternatives
Compare EP3C25F256C8NES with alternatives