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EP3C25F256I7N vs EP3C25F256C8 feature comparison

EP3C25F256I7N Altera Corporation

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EP3C25F256C8 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer ALTERA CORP INTEL CORP
Part Package Code BGA
Package Description 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count 256
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel Intel
Clock Frequency-Max 472.5 MHz 472.5 MHz
JESD-30 Code R-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24624 24624
Number of Inputs 156 156
Number of Logic Cells 24624 24624
Number of Outputs 156 156
Number of Terminals 256 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24624 CLBS 24624 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 17 mm
Base Number Matches 2 2
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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