EP610DM883B
vs
PAL16R6BML883B
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
|
Ihs Manufacturer |
ALTERA CORP
|
|
Package Description |
DIP, DIP24,.3
|
|
Reach Compliance Code |
unknown
|
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
|
Architecture |
PAL-TYPE
|
|
Clock Frequency-Max |
28.6 MHz
|
|
JESD-30 Code |
R-XDIP-T24
|
|
JESD-609 Code |
e0
|
|
Number of Inputs |
20
|
|
Number of Outputs |
16
|
|
Number of Product Terms |
160
|
|
Number of Terminals |
24
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Output Function |
MACROCELL
|
|
Package Body Material |
CERAMIC
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP24,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Peak Reflow Temperature (Cel) |
220
|
|
Propagation Delay |
37 ns
|
|
Qualification Status |
Not Qualified
|
|
Screening Level |
38535Q/M;38534H;883B
|
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
1
|
|
|
|
|
Compare EP610DM883B with alternatives