EXBE10C820J vs RACF408M825%R feature comparison

EXBE10C820J Panasonic Electronic Components

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RACF408M825%R SEI Stackpole Electronics Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PANASONIC CORP STACKPOLE ELECTRONICS INC
Package Description CHIP CHIP, ROHS COMPLIANT
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.20 8533.21.00.20
Factory Lead Time 54 Weeks
Samacsys Manufacturer Panasonic
Construction Rectangular Chip
Element Power Dissipation 0.063 W 0.063 W
First Element Resistance 82 Ω 82 Ω
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Network Type BUSSED BUSSED
Number of Elements 8 8
Number of Functions 1 1
Number of Terminals 10 10
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 4 mm 4 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.1 mm 2.1 mm
Packing Method TR, EMBOSSED, 7 INCH TAPE, EMBOSSED
Rated Temperature 70 °C 70 °C
Reference Standard IEC60115-9
Resistance 82 Ω 82 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 82 Ω
Size Code 1608 0816
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish MATTE TIN OVER NICKEL Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Manufacturer Series RAC
Rated Power Dissipation (P) 0.063 W
Series RAC408M(5%)

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Compare RACF408M825%R with alternatives