EZ80F91AZA50SG
vs
EZ80F91NAA50EG
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ZILOG INC
|
ZILOG INC
|
Part Package Code |
QFP
|
BGA
|
Package Description |
LFQFP, QFP144,.87SQ,20
|
LBGA, BGA144,12X12,40
|
Pin Count |
144
|
144
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
24
|
24
|
Bit Size |
8
|
8
|
CPU Family |
Z80
|
Z80
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B144
|
Length |
20 mm
|
13 mm
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
144
|
144
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LBGA
|
Package Equivalence Code |
QFP144,.87SQ,20
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
16384
|
16384
|
ROM (words) |
262144
|
262144
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.5 mm
|
Speed |
50 MHz
|
50 MHz
|
Supply Current-Max |
190 mA
|
190 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3.3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
20 mm
|
13 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare EZ80F91AZA50SG with alternatives
Compare EZ80F91NAA50EG with alternatives