EZR32WG330F256R68G
vs
EZR32WG330F256R68G-C0
feature comparison
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SILICON LABORATORIES INC
|
| Package Description |
HVQCCN,
|
HVQCCN,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| CPU Family |
CORTEX-M4
|
CORTEX-M4
|
| Clock Frequency-Max |
32 MHz
|
48 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-XQCC-N64
|
S-XQCC-N64
|
| Length |
9 mm
|
9 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of External Interrupts |
16
|
|
| Number of I/O Lines |
38
|
38
|
| Number of Serial I/Os |
7
|
6
|
| Number of Terminals |
64
|
64
|
| Number of Timers |
7
|
6
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
LCC64,.35SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| RAM (bytes) |
32768
|
32768
|
| ROM (words) |
262144
|
262144
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Speed |
48 MHz
|
48 MHz
|
| Supply Voltage-Max |
3.8 V
|
3.8 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
9 mm
|
9 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
5
|
2
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2019-11-15
|
| Samacsys Manufacturer |
|
Silicon Labs
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare EZR32WG330F256R68G with alternatives
Compare EZR32WG330F256R68G-C0 with alternatives