F356535S vs S63364C-P feature comparison

F356535S Fairchild Semiconductor Corporation

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S63364C-P Gould Ami

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP GOULD AMI
Part Package Code DIP
Package Description DIP, ,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 170 ns 450 ns
JESD-30 Code R-GDIP-T24 R-PDIP-T24
Length 32.0675 mm
Memory Density 16777216 bit 16384 bit
Memory IC Type MASK ROM CARD MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 2MX8 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.37 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Supply Current-Max 0.1 mA
Temperature Grade COMMERCIAL

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