F356635P vs HB1264B-Y-000 feature comparison

F356635P Fairchild Semiconductor Corporation

Buy Now Datasheet

HB1264B-Y-000 Hughes Aircraft

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP HUGHES AIRCRAFT
Part Package Code DIP
Package Description DIP, ,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 200 ns 200 ns
JESD-30 Code R-PDIP-T24 R-GDIP-T24
Length 31.75 mm
Memory Density 4194304 bit 131072 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 512KX8 16KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.698 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Supply Current-Max 0.035 mA
Temperature Grade MILITARY

Compare F356635P with alternatives

Compare HB1264B-Y-000 with alternatives