FHD56
vs
BAW56T
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
FENGHUA ADVANCED TECHNOLOGY
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOT-23
|
SC-75
|
Package Description |
R-PDSO-G3
|
PLASTIC, SMD, SC-75, 3 PIN
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
Application |
GENERAL PURPOSE
|
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON ANODE, 2 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.25 V
|
1.25 V
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
Non-rep Pk Forward Current-Max |
0.5 A
|
4 A
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.225 W
|
0.17 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
70 V
|
90 V
|
Reverse Recovery Time-Max |
0.006 µs
|
0.004 µs
|
Surface Mount |
YES
|
YES
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
20
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Output Current-Max |
|
0.15 A
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare FHD56 with alternatives
Compare BAW56T with alternatives