FS1KE-TP
vs
DLFR106
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICRO COMMERCIAL COMPONENTS
|
Package Description |
R-PDSO-C2
|
O-PELF-R2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.3 V
|
1.3 V
|
JESD-30 Code |
R-PDSO-C2
|
O-PELF-R2
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Non-rep Pk Forward Current-Max |
30 A
|
30 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
800 V
|
800 V
|
Reverse Current-Max |
5 µA
|
5 µA
|
Reverse Recovery Time-Max |
0.5 µs
|
0.25 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
C BEND
|
WRAP AROUND
|
Terminal Position |
DUAL
|
END
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Base Number Matches |
2
|
3
|
Part Package Code |
|
MELF
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Case Connection |
|
ISOLATED
|
|
|
|
Compare FS1KE-TP with alternatives
Compare DLFR106 with alternatives