FSA1156P6X_NL
vs
ISL84715IHZ-T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
INTERSIL CORP
|
| Part Package Code |
SOIC
|
SC
|
| Package Description |
TSSOP, TSSOP6,.08
|
TSSOP, TSSOP6,.08
|
| Pin Count |
6
|
705
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
5
|
| On-state Resistance-Max (Ron) |
2.1 Ω
|
0.6 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP6,.08
|
TSSOP6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Switch-on Time-Max |
40 ns
|
22 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
26 Weeks
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Switch-off Time-Max |
|
11 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare FSA1156P6X_NL with alternatives
Compare ISL84715IHZ-T with alternatives