FSA66M5X
vs
NC7SZ66M5X
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Package Description |
LSSOP, TSOP5/6,.11,37
|
1.60 MM, MO-178AA, SOT-23, 5 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Date Of Intro |
2017-10-25
|
|
| Analog IC - Other Type |
SPST
|
SPST
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
|
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| Length |
2.9 mm
|
2.9 mm
|
| Normal Position |
NO
|
NO
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Off-state Isolation-Nom |
50 dB
|
50 dB
|
| On-state Resistance Match-Nom |
125 Ω
|
125 Ω
|
| On-state Resistance-Max (Ron) |
60 Ω
|
60 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
1.4 mm
|
1.45 mm
|
| Supply Current-Max (Isup) |
0.01 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
18.2 ns
|
18.2 ns
|
| Switch-on Time-Max |
14.2 ns
|
14.2 ns
|
| Switching |
MAKE-BEFORE-BREAK
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
3
|
5
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOT-23
|
| Pin Count |
|
5
|
| Manufacturer Package Code |
|
5LD, SOT23, JEDEC MO-178, 1.6MM
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare FSA66M5X with alternatives
Compare NC7SZ66M5X with alternatives