FST16861MTD
vs
PI3C34EX245BEX
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
6.10 MM, MO-153ED, TSSOP-48
|
SSOP,
|
| Pin Count |
48
|
80
|
| Reach Compliance Code |
unknown
|
compliant
|
| Family |
CBT/FST/QS/5C/B
|
CB3Q/3VH/3C/2B
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G80
|
| JESD-609 Code |
e3
|
e3
|
| Length |
12.5 mm
|
20.5 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of Bits |
10
|
8
|
| Number of Functions |
2
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
48
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
6.1 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
SSOP80,.25,20
|
|
|
|
Compare FST16861MTD with alternatives
Compare PI3C34EX245BEX with alternatives