FT232RQ-REEL
vs
UPD1002T-AI/MQ
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Obsolete
|
Ihs Manufacturer |
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
|
Package Description |
QFN-32
|
SQFN-32
|
Pin Count |
32
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
FTDI Chip
|
Microchip
|
Address Bus Width |
|
|
Bus Compatibility |
USB
|
SMBUS; SPI; VBUS
|
Clock Frequency-Max |
12.02 MHz
|
|
Data Transfer Rate-Max |
60 MBps
|
|
Drive Interface Standard |
RS232; RS422; RS485
|
|
External Data Bus Width |
|
|
JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC32,.2SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.9 mm
|
1 mm
|
Supply Current-Max |
0.1 mA
|
|
Supply Voltage-Max |
5.25 V
|
5.3 V
|
Supply Voltage-Min |
3.3 V
|
3.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
5 mm
|
5 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
Screening Level |
|
TS 16949
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare FT232RQ-REEL with alternatives
Compare UPD1002T-AI/MQ with alternatives