GD54HC03D vs MC74HC03ADG feature comparison

GD54HC03D Goldstar Electron Co Ltd

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MC74HC03ADG onsemi

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD ON SEMICONDUCTOR
Package Description , SOP, SOP14,.25
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 26 ns 180 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 2
Source Content uid MC74HC03ADG
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Manufacturer Package Code 751A-03
ECCN Code EAR99
HTS Code 8542.39.00.01
Factory Lead Time 3 Weeks, 6 Days
JESD-609 Code e3
Length 8.65 mm
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Code SOP
Package Equivalence Code SOP14,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 36 ns
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Terminal Finish Matte Tin (Sn) - annealed
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm

Compare GD54HC03D with alternatives

Compare MC74HC03ADG with alternatives