Findchips: Compare GD54HC157D vs 74HC157PW,112

GD54HC157D vs 74HC157PW,112 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	GOLDSTAR ELECTRON CO LTD	NXP SEMICONDUCTORS
Package Description	,	4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Reach Compliance Code	unknown	compliant
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G16	R-PDSO-G16
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	MULTIPLEXER	MULTIPLEXER
Number of Functions	4	4
Number of Inputs	2	2
Number of Outputs	1	1
Number of Terminals	16	16
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)	44 ns	38 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Position	DUAL	DUAL
Base Number Matches	1	2
Rohs Code		Yes
Part Package Code		TSSOP
Pin Count		16
Manufacturer Package Code		SOT403-1
HTS Code		8542.39.00.01
Factory Lead Time		4 Weeks
JESD-609 Code		e4
Length		5 mm
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		TSSOP16,.25
Packing Method		TUBE
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		38 ns
Seated Height-Max		1.1 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		0.65 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		4.4 mm
	Logic » Multiplexer/Demultiplexers	Logic » Multiplexer/Demultiplexers