GD54HC157D
vs
HD74HC157TELL
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
GOLDSTAR ELECTRON CO LTD
|
RENESAS ELECTRONICS CORP
|
| Package Description |
,
|
TSSOP, TSSOP16,.25
|
| Reach Compliance Code |
unknown
|
compliant
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
44 ns
|
155 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
5 mm
|
| Max I(ol) |
|
0.004 A
|
| Moisture Sensitivity Level |
|
1
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
31 ns
|
| Seated Height-Max |
|
1.1 mm
|
| Terminal Pitch |
|
0.65 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
4.4 mm
|
|
|
|
Compare GD54HC157D with alternatives
Compare HD74HC157TELL with alternatives