GD74HC00 vs MC74HC00AFEL feature comparison

GD74HC00 MagnaChip Semiconductor Ltd

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MC74HC00AFEL onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAGNACHIP SEMICONDUCTOR LTD ONSEMI
Package Description DIP, EIAJ, SO-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 115 ns 110 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 4 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
Factory Lead Time 4 Weeks
JESD-609 Code e4
Length 10.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 22 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2.05 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Width 5.275 mm

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