GD74HC00J vs SNJ54HC00J feature comparison

GD74HC00J Goldstar Electron Co Ltd

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SNJ54HC00J Rochester Electronics LLC

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD ROCHESTER ELECTRONICS LLC
Package Description , HERMETIC SEALED, CERAMIC, DIP-14
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-GDIP-T14
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 23 ns 135 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Additional Feature LG-MAX
Length 19.94 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-PRF-38535
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare GD74HC00J with alternatives

Compare SNJ54HC00J with alternatives