GD74HCT132J vs CD54HCT132F3A feature comparison

GD74HCT132J Goldstar Electron Co Ltd

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CD54HCT132F3A Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD TEXAS INSTRUMENTS INC
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
Family HCT HCT
JESD-30 Code R-CDIP-T14 R-GDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 1
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 38 ns 50 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code No
Part Package Code DIP
Pin Count 14
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Texas Instruments
JESD-609 Code e0
Length 19.56 mm
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 50 ns
Schmitt Trigger YES
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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